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MCM Die Bonder at mcm-die-bonder.com

Integrated Process Solution

The semiconductor market is increasingly calling for customized all-in-one solutions - moving away from standalone machines and towards "integrated process solutions". Therefore Datacon offers a flexible and 100% customer-oriented all-round solutions with its IPS department.
The target of the Integrated Process Solution (IPS) group is to provide special machines that are needed in combination with Datacon's standard equipment in order to deliver full-fledged production solutions.
The main focus of these solutions is quality assurance by electrical test or visual inspection. Quality assurance as early as possible helps customers to figure out and avoid process issues. Therefore yield and quality increases and in direct consequence production costs are decreasing.

Die-Bonding Technology by mcm-die-bonder.com

MCM Die Bonder at mcm-die-bonder.com
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